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Wafer Level Packaging Technology Development Senior Manager

Skyworks
Osaka, Japan
On-site

About this role

About the Role Skyworks is seeking a Wafer Level Packaging Technology Development Senior Manager to lead our team in driving technological advancements, push the boundaries of our technology and improve the overall SAW Development Organization within the SAW Filter New Product / New Technology Group. As a highly skilled and strategic leader, you will play pivotal role to successfully deliver new technologies meeting Performance, Quality and Time-to-Market. Having affinity with innovative solutions which can be applied throughout development to high-volume manufacturing, you will ensure a seamless communication across various department in a multicultural environment with teams like Products Engineers, Device, Process experts, Module Design Team, Program Management and Operations. What You'll Do

  • Develop and implement a comprehensive Technology Development strategy aligned with company’s overall goals.
  • Lead, mentor and inspire a multidisciplinary team of Process Engineers, while fostering a culture of innovation, continuous improvement within the technology team.
  • Collaborate with cross-functional teams to define project scope, goals, and deliverables.
  • Drive end-to-end development lifecycle, ensuring development projects are delivered to production release, meeting Quality, Performance and Schedule.
  • Conduct detailed assessment of new technologies and equipment, making recommendation for adoption or enhancement.
  • Identify potential risks/challenges in technology development projects and develop mitigation plans.
  • Work with the NPI Team and assist in transition of design prototypes into cost efficient and high-volume manufacturable technologies.
  • Collaborate and openly debate with team to manage projects, solve problems, discuss challenging issues, and learn more about critical issues as a group.
  • Implement or improve solutions to minimize disruptions in the NTI/NPI workflow.
  • Identify and drive continuous improvement in your organization, NTI process and associated department through feedback loops to capture lessons learned from each Technology Project.
  • Report and maintain knowledge on Technology status to executive leadership by preparing appropriate reports. What We're Looking For
  • M.S. or Ph.D. in Engineering, Material Science, Physics, RF Engineering preferred.
  • Minimum of 8 years of experience in Technology Development or Integration including following processes: Lithography, Polymer Patterning, Wafer Bonding, Solder Plating, Laser/Plasma Dicing.
  • Knowledge in Material properties and modelling (Ansys, FEM).
  • Excellent leadership, communication with interpersonal skills and used to work in a multi-cultural environment.
  • Experience in SAW/BAW Technology Development and manufacturing.

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