Technical Program Manager (MCL)

Lead the development of next-generation silicon direct cooling technologies vis-à-vis Micro Channel Lid or Direct Silicon cooling to enable higher-performance computing platforms, collaborating closely with cross-functional engineering teams and external ecosystem partners including semiconductor packaging providers, silicon/ASIC vendors, and system integrators (ODMs).

Drive thermal management innovation across platforms ranging from general-purpose servers to advanced GPU systems, while demonstrating technical leadership in packaging technologies to address increasingly complex cooling challenges driven by rising compute density and power requirements

Key Objectives & Success Measures

Develop strong partnerships with external compute systems that are pertinent to the program

Negotiate for win-win on terms and conditions with internal and external partners

Define short and long-term milestones with all parties

Flawlessly execute the agreed upon milestones and track progress

Develop key IPs for CoolIT where possible to strengthen our foothold in this field

Key Responsibilities

• Technical Development & Leadership

• Build out the internal and external support infrastructure for this new MCL and direct cooling technology

• Act as the key POC for external packaging companies, silicon vendors, and system integrator including OEMs and/or ODMs

• Lead by influence by clearly articulating the vision of this technology

• Technical Customer Engagement

• Act as the primary technical interface for this micro-channel lid or direct cooling technology to engage customers while partnering closely with internal teams

• Sensitize and translate partners’ and customers’ requests and pain points into actionable items to drive solution

• Support design reviews, technical enablement, failure analysis, and customer engagement

• Understanding of customers’ and silicon roadmap to determine how CoolIT’s technical capability can provide value

• Partner Management

• Build strong relationships across internal functional organizations: Advanced Technology Group, Coldplate engineering, and/or CDU engineering.

• Partner with our manufacturing operations to ensure CoolIT’s products are built with DFx (DFM, DFS, DFT, etc) in mind

• Preferred

• Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.

• Prior experience in electronic packaging industry and/or chip design industry

• Established relationships within OSATs, ODMs and/or chip vendors

• Skills & Attributes

• Highly analytical and strategic thinker with quality and reliability of product in mind

• Skilled in DFx (x = manufacturability, reliability, and/or test)

• Comfortable in operating with ambiguity in fast‑evolving technology markets

• Excellent communication skills in English; Mandarin proficiency strongly preferred