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Staff Chemical Mechanical Planarization (CMP) Engineer

Intel
Hillsboro, Oregon, United States
On-site

About this role

About the Role Intel Foundry Technology Manufacturing and MDCE are seeking a Staff CMP Engineer to lead CMP process development and technology ramp for advanced logic nodes (18A, Intel 3, Intel 12nm) and to own cross-node standardization for high-volume manufacturing readiness. What You'll Do

  • Lead CMP process development from concept through HVM across multiple advanced technology nodes.
  • Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield.
  • Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies.
  • Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions.
  • Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production.
  • Drive continuous improvement to enhance process capability, yield, and manufacturing efficiency.
  • Collaborate with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams.
  • Engage with equipment and consumables suppliers to co-develop and optimize CMP solutions.
  • Mentor junior engineers and provide technical guidance across the organization. What We're Looking For
  • Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field.
  • 5+ years of experience in semiconductor manufacturing / process development or technology development.
  • 3+ years of direct CMP process development experience with hands-on process tuning and characterization.
  • Experience with major CMP equipment platforms (e.g., AMAT, Ebara).
  • Experience with CMP consumables (slurries, pads, conditioning disks, filters, clean chemistries).
  • Preferred: Doctorate in related fields.
  • Experience with advanced technology nodes (e.g., sub-10nm logic; Gate All Around) and track record of successful technology development and HVM.
  • Cross-functional leadership experience, including lead for yield improvement initiatives.
  • Experience with CMP integration with other process modules (deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield.
  • Experience with CMP-relevant metrology and process control (thickness, topography, defects, roughness, particles).
  • Strong communication skills, adaptability, initiative and a safety/quality mindset. Nice to Have
  • Doctorate in related field.
  • Cross-functional leadership experience and task-force leadership for yield improvements.
  • Experience with advanced CMP metrology and process control.
  • Experience with CMP integration with other process modules and CMP-relevant metrology. Compensation & Benefits
  • Not disclosed in job posting, competitive compensation and comprehensive benefits available.

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