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Sr. Staff Package Design Engineer - MIS substrate/FC expose die
Renesas Electronics
onsite
Taichung, Taiwan Posted Jul 8, 2026
About this role
Sr. Staff Package Design Engineer - MIS substrate/FC expose die
Job Description
Key Responsibilities
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.
- Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
- Ensure smooth transition into production & implement ramp up monitor.
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