About this role
Sr Staff Engineer
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Package Development & NPI Support Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled (DSC) Top-side cooled (TSC). Advanced lead frame and clip-bond packages Define package requirements and specifications for new product development. Support package qualification and AEC-Q101 compliance activities. Drive package-related activities during NPI and product transition.
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Thermal & Mechanical Engineering Perform thermal analysis and package characterization. Conduct thermal resistance and thermal impedance measurements. Evaluate package reliability associated with: Power cycling, Thermal cycling, Solder joint reliability, Mechanical stress Support package-level failure analysis and root cause investigation.
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Package Benchmarking & Technology Survey Benchmark competitor power package technologies. Analyze package construction, materials, and performance. Identify technology trends and recommend future package roadmaps. Conduct package reverse engineering and technical assessments.
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Simulation & Modeling Develop and maintain thermal simulation models. Support electrical and mechanical package simulations. Correlate simulation results with measurement data. Collaborate with system engineers on thermal optimization and system-level performance evaluation.
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Product & Customer Support Support customer inquiries regarding: Thermal performance, Package selection, Reliability considerations Work with Application Engineering teams on customer design support. Develop package-related technical documentation and application notes.
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Cross-Functional Collaboration Coordinate package activities with: Design Engineering, Product Engineering, Reliability Engineering, Manufacturing, Marketing, External package suppliers Participate in product definition reviews and technical decision-making.