SR ENGINEER, ADVANCED PROCESS DEVELOPMENT

SR ENGINEER, ADVANCED PROCESS DEVELOPMENT

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Hybrid Bond Assembly Process Development Engineer

The successful candidate will be responsible for development, optimization, qualification, and technology transfer of advanced packaging assembly processes, with primary focus on hybrid bonding / advanced die stacking technologies for HBM and next-generation products. Assembly process development, hybrid-bond paths, C2W activities, qualification, and transfer work.

Develop, optimize, and characterize hybrid bonding and advanced stacking assembly processes for next-generation HBM products.

• Own process development from concept/feasibility through qualification and manufacturing transfer.
• Drive process-window development, DOE, characterization, optimization, and robustness improvement.
• Support C2W / advanced die-stacking integration, including bonding-related upstream and downstream process interactions. Internal work specifically references C2W hybrid-bond activities.
• Develop and maintain process specifications, control plans, qualification criteria, and manufacturing documentation.
• Lead equipment evaluation, process/tool qualification, and capability improvement, working with equipment suppliers and internal equipment teams.
• Execute structured root-cause analysis and problem solving for yield, quality, reliability, defect, and process integration issues.
• Apply risk-analysis methodologies such as pFMEA during NPI and process qualification. Current HBM4/HBM4E work includes explicit pFMEA alignment activities.
• Analyze experimental and manufacturing data using statistical methods to identify key process parameters, interactions, and improvement opportunities.
• Collaborate closely with process integration, equipment, product, quality, manufacturing, materials, and supplier teams to deliver technology milestones.
• Support NPI readiness and cross-site technology transfer, including process-condition alignment, training, documentation, and manufacturing ramp readiness. Internal HBM4E work includes process-condition alignment and SG transfer/training activity.
• Drive continuous improvement in yield, quality, cost, cycle time, process capability, and equipment productivity.
• Participate in technical reviews and clearly communicate development status, risks, data, conclusions, and recommendations to cross-functional stakeholders.
• Familiarity with efficiency problem solving such as KT analysis, Five Whys Technique, 8D Problem Solving.
• Using AI on daily work.

Required Skills

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Semiconductor Engineering, Physics, or related discipline.

• Strong understanding of semiconductor assembly, wafer-level packaging, or advanced packaging processes.

• Hands-on experience in process development, process integration, equipment engineering, or manufacturing engineering.

• Strong knowledge of DOE, SPC, process capability, statistical analysis, FMEA/pFMEA, and structured problem-solving methodologies.

• Ability to perform systematic data analysis, failure analysis, root-cause identification, and process optimization.

• Understanding of semiconductor NPI, process qualification, change control, and technology-transfer methodology.

• Ability to establish process windows and translate development learning into manufacturable process controls.

• Hybrid Bond / Advanced Packaging Knowledge Preferred

I would make these preferred rather than mandatory, otherwise the candidate pool may become unnecessarily narrow:

• Experience with hybrid bonding, direct bonding, Cu-Cu bonding, C2W, W2W, or high-accuracy die stacking.
• Understanding of hybrid-bonding critical factors such as: Surface preparation and cleanliness Particle/contamination control Bond interface quality Alignment accuracy Wafer/die warpage Bonding temperature/pressure/process window Post-bond inspection and defect analysis
• Knowledge of upstream/downstream advanced assembly processes such as wafer preparation, cleaning, dicing, die handling, bonding, encapsulation, thinning, and metrology.
• Experience with advanced packaging / HBM manufacturing environments.