Software Developer - Packaging/IC

Job title: Software Developer - Packaging/IC

Job Description

Description

• The Packaging EDA group automates and standardizes the flows behind RF and AMS module packaging and the back-end IC wafer flows that feed them—spanning design-to-die, wirebond/bump interconnect, substrate routing, EM-aware layout, DRC/signoff, and the post-tapeout data that drives manufacturing. We are expanding beyond our traditional Cadence Allegro/APD SKILL and DRC automation into modern software engineering: Python-based tooling, database-driven workflows, and web-based enterprise platforms that manage data across the full IC lifecycle, from floorplanning to material-in-hand.

• This is a hybrid role for a software developer who has worked in the Packaging/IC realm. Day to day, you may be asked to support active packaging and wafer-flow activities while also designing and building the long-term software solutions that will replace today's manual and spreadsheet-based processes. The balance between hands-on support and platform development will evolve over time, so we're looking for someone adaptable who is comfortable moving between immediate problem-solving and longer-term engineering.

• The core technical need is Python, database, and web-application expertise to modernize existing spreadsheet- and VBA-based wafer flows into maintainable, connected platforms. Packaging-layout automation and tool experience (SKILL/APD) is a strong plus as design work will need to be supported by multiple members of our team, and we lean on AI-assisted development to extend it. You'll partner closely with a domain expert who owns the IC wafer flows and deep process knowledge, translating that expertise into robust, scalable software.

Responsibilities

• Design and build Python applications and web-based enterprise platforms that support the packaging and wafer-flow lifecycle, replacing spreadsheet/VBA solutions with maintainable, database-connected systems. Lead the conversion of an existing VBA solution into a web-based platform that communicates with multiple databases, provides UIs for pre-tapeout (pre-TO) inputs, supports a shopping cart style workflow for post-TO interactions, and runs automated triggers and DRCs throughout the IC lifecycle (floorplanning to material-in-hand). Develop automation for post-TO data gathering to support bump mask ge