About this role
Job title: Senior Technologist, Hybrid Bonding Module
About the Role As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies. This role enables Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind platform development and optimization of manufacturing processes to support development and high-volume manufacturing.
What You'll Do
- Drive process and equipment development for die-to-wafer hybrid bonding technologies and related platform advancement.
- Develop and optimize manufacturing processes to support both development and high-volume production milestones.
- Contribute to first-of-a-kind platform development and technology maturation in collaboration with cross-functional teams.
- Collaborate with equipment engineering, process engineering, and product teams to enable Intel's leadership in advanced packaging.
What We're Looking For
- Deep technical expertise in hybrid bonding process or equipment engineering.
- Experience in process development and equipment engineering for semiconductor packaging or related manufacturing.
- Track record of contributing to platform development, process optimization, and high-volume manufacturing readiness.
- Strong problem-solving, communication, and cross-functional collaboration skills.