Senior Staff Failure Analysis Engineer

About the Role

We are seeking a highly motivated and experienced Senior Staff Failure Analysis Engineer to lead complex semiconductor failure analysis investigations for advanced technology and AI-related products. The ideal candidate will possess strong expertise in electrical verification, fault isolation, and physical failure analysis, with a proven track record of resolving challenging product reliability and customer-return issues. The role requires close collaboration with design, process integration, product engineering, reliability, and manufacturing teams to identify root causes and drive corrective actions. What You'll Do

• Lead end-to-end failure analysis activities for engineering, qualification, reliability, manufacturing, and customer-returned devices.

• Drive corrective and preventive actions with cross-functional teams to improve product quality, yield, and reliability.

• Perform detailed electrical verification and characterization to validate failure signatures and reproduce failure conditions.

• Support technology development, new product introduction, and process qualification activities. Correlate electrical, physical, design, process, and reliability data to determine root cause of failures.

• Develop innovative FA methodologies and best practices to improve diagnostic efficiency and success rates.

• Prepare comprehensive technical reports and present investigation findings to management and customers.

• Utilize advanced fault isolation techniques to localize defects, including but not limited to: OBIRCH, Thermal HS Imaging, PEM, Parametric Analyzer, Bench Set Up for Functional Failures, Time Domain Reflectometry (TDR).

• Conduct and interpret physical failure analysis using techniques such as: C-SAM, 2D & 3D X-Ray, SEM, EDX.

• Package level and die level delayering and cross-sectioning

• Material and structural characterization What We're Looking For

• Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Physics, Semiconductor Engineering, or related disciplines.

• Minimum 7 years of hands-on experience in semiconductor failure analysis, including practical execution of fault isolation and physical analysis techniques.

• Strong knowledge of semiconductor device physics and integrated circuit operation.

• Proficient in CAD and schematic interpretation.

• Demonstrated expertise in: Electrical verification and characterization, Fault isolation methodologies, Physical failure analysis, Root cause analysis methodologies.

• Experience with advanced semiconductor technologies and complex IC products.

• Strong analytical, problem-solving, and troubleshooting skills.

• Excellent communication skills with the ability to present technical findings to diverse stakeholders.

• Ability to manage multiple projects and work effectively in a fast-paced environment. Nice to Have

• Experience supporting AI, HPC, Data Center, GPU, Accelerator, or Advanced Packaging products.

• Familiarity with AI hardware architectures, advanced nodes, heterogeneous integration, or system-level failure analysis.

• Knowledge of reliability testing, ESD, latch-up, EOS, and silicon debug methodologies.

• Experience in electrical failure node interpretation, physical analysis and knowledge in Smart Power Stage (SPS) packages.

• Ability to interpret CAD layouts, schematics, and design documentation to support failure root cause determination.

• Previous experience leading cross-functional technical investigations and customer-facing failure analysis activities.

• Programming or data analytics skills are advantageous. Compensation & Benefits

Not disclosed in the posting.