About this role
Job title: Senior Process Engineer
About the Role The Senior Process Engineer will develop sealing and attachment processes for advanced optoelectronic packages and collaborate with R&D, product design, manufacturing, suppliers, and customers to ensure components meet stringent optical, mechanical, and Telcordia reliability requirements.
What You'll Do
- Develop and implement processes to attach various components
- Own automated process development using die-attach tools, including process setup, alignment and recipes
- Design and implement solder hierarchies to support multiple reflows without reflow or voiding
- Develop hermetic lid-sealing process via electrical or laser welding, or soldering to seal ring
- Develop hermetic fiber-sealing process to housing to achieve leak rate < 10^-8 He std atm-cc/s and high-proof strength (> 5N)
- Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
- Define process windows, control plans, and critical-to-quality parameters
- Support component supplier selection and evaluation of: housing, lid, seal rings, fiber-feedthrough
- Evaluate process capability and maturity
- Define and oversee component pre-qualification tests to ensure reliable designs
- Support failure analysis investigations and corrective actions for product related failures and manufacturing issues
- Drive corrective actions across materials, processes and supplier inputs
What We're Looking For
- MS in Materials Science, Mechanical Engineering, Physics, Optics, or a closely related field
- At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
- Hands-on experience with DOE, DFM, statistical tools for efficient optimization
- Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
- Experience of process-attach issues
- Experience with optical components, stable attachment methods
- Expertise in component qualification methodologies and product reliability testing
- Experience with solder-process failures through failure mode analysis tools
- Experience with New Product Introduction methodology: design, verification, qualification, release to manufacturing
- Strong communication skills with suppliers and cross-functional internal teams
Compensation & Benefits
- Salary: USD 160,000 - 250,000 per year
- This role is eligible for variable pay, issued as a monetary bonus or in another form
- Benefits include medical, dental, vision, flexible spending accounts and health savings accounts, life insurance, accidental death and disability, disability, retirement, paid vacation/time off, educational assistance, infertility assistance, paid parental leave and adoption assistance
- Specific eligibility criteria are set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region
- Additional information: Koch is an Equal Opportunity Employer, supports diversity, and participates in E-Verify