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Senior Process Engineer

Koch IP Holdings, LLC.
USD 160,000 - 250,000 / year

About this role

Job title: Senior Process Engineer

About the Role The Senior Process Engineer will develop sealing and attachment processes for advanced optoelectronic packages and collaborate with R&D, product design, manufacturing, suppliers, and customers to ensure components meet stringent optical, mechanical, and Telcordia reliability requirements.

What You'll Do

  • Develop and implement processes to attach various components
  • Own automated process development using die-attach tools, including process setup, alignment and recipes
  • Design and implement solder hierarchies to support multiple reflows without reflow or voiding
  • Develop hermetic lid-sealing process via electrical or laser welding, or soldering to seal ring
  • Develop hermetic fiber-sealing process to housing to achieve leak rate < 10^-8 He std atm-cc/s and high-proof strength (> 5N)
  • Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
  • Define process windows, control plans, and critical-to-quality parameters
  • Support component supplier selection and evaluation of: housing, lid, seal rings, fiber-feedthrough
  • Evaluate process capability and maturity
  • Define and oversee component pre-qualification tests to ensure reliable designs
  • Support failure analysis investigations and corrective actions for product related failures and manufacturing issues
  • Drive corrective actions across materials, processes and supplier inputs

What We're Looking For

  • MS in Materials Science, Mechanical Engineering, Physics, Optics, or a closely related field
  • At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
  • Hands-on experience with DOE, DFM, statistical tools for efficient optimization
  • Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
  • Experience of process-attach issues
  • Experience with optical components, stable attachment methods
  • Expertise in component qualification methodologies and product reliability testing
  • Experience with solder-process failures through failure mode analysis tools
  • Experience with New Product Introduction methodology: design, verification, qualification, release to manufacturing
  • Strong communication skills with suppliers and cross-functional internal teams

Compensation & Benefits

  • Salary: USD 160,000 - 250,000 per year
  • This role is eligible for variable pay, issued as a monetary bonus or in another form
  • Benefits include medical, dental, vision, flexible spending accounts and health savings accounts, life insurance, accidental death and disability, disability, retirement, paid vacation/time off, educational assistance, infertility assistance, paid parental leave and adoption assistance
  • Specific eligibility criteria are set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region
  • Additional information: Koch is an Equal Opportunity Employer, supports diversity, and participates in E-Verify

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