About this role
About the Role Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) builds the core infrastructure for Microsoft's Intelligent Cloud. We are seeking a Senior IC Packaging Engineer to design, develop, and deliver advanced IC packaging solutions for cloud-scale silicon, ensuring performance, reliability, and manufacturability across Microsoft data centers. What You'll Do
- Design, develop, and validate IC packaging architectures (flip-chip, wafer-level packaging, and related technologies) for high-performance server CPUs/SoCs used in Microsoft data centers.
- Lead thermal, mechanical, and reliability analyses; develop test methods and qualification plans per industry standards.
- Collaborate with silicon design teams, PCB/EM teams, manufacturing, and test to ensure robust, manufacturable packaging solutions at scale.
- Define package topology, materials, interposers, substrates, and integration with memory and interconnects; drive design-for-manufacturability and yield improvement.
- Own product qualification, process development, cost-out, and production ramp activities; mentor junior engineers. What We're Looking For
- Bachelor's degree in Electrical Engineering, Materials Science, or related field; 5+ years in IC packaging or related packaging experience.
- Experience with advanced packaging technologies (flip-chip, wafer-level packaging, SiP, 2.5D/3D integration) for cloud-scale compute.
- Strong thermal and mechanical design experience, reliability testing, and failure analysis; familiarity with JEDEC standards.
- Proficiency with packaging CAD/SI tools, simulation, and data analysis; excellent cross-functional collaboration and communication skills. Nice to Have
- PhD or equivalent experience; experience with 3D integration, TSVs, advanced substrates.
- Experience in high-volume manufacturing environments and cost-out initiatives.