About this role
About the Role The Senior Field Process Engineer (FPE) leads on-site process development and joint qualification of new ASM systems and products at customer sites, working closely with customer R&D, technology development teams and business units to drive successful NPI deployments. What You'll Do
- Lead joint process development and qualification of new ASM systems/products at customer sites (NPI)
- Receive training on newly developed deposition processes (PEALD, PECVD, Epitaxy, LPCVD/vertical furnace) and hardware; manage introduction and transfer of processes and hardware to customer sites
- Collaborate with field hardware, service, sales teams, and Business Units to support and troubleshoot new product issues
- Develop proposals for equipment and process design improvements; conduct experiments with customers; escalate issues to ensure timely resolution per project scope and timelines
- Document NPI learnings to support future IQ, hardware, and process rollout packages; facilitate knowledge transfer to local process and service teams
- Provide in-depth process and equipment expertise, troubleshooting leadership, and escalation support to ensure successful NPI implementation
- On-Site Process Development: support customer deposition process/hardware development; design/execute experiments for device integration, process development, troubleshooting, and CIP
- Analyze baseline process and system performance; identify gaps relative to technology node requirements
- Perform problem assessment and root cause analysis of system performance non-conformances at customer sites
- Identify and develop new opportunities for ASM process and hardware introductions at customer sites
- HVM Process Transfer: lead process transfer to HVM fabs; document learnings, develop BKMs; transfer BKMs to HVM site teams
- Travel as required; mainly onsite Boise with domestic and international travel for escalations, transfers, and HVM site support What We're Looking For
- Education: PhD preferred; Master’s or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related discipline
- Experience & Skills: Equivalent combination of education and experience with strong fundamentals in thin-film processing, development, and characterization using deposition reactors such as thermal ALD, PEALD, PECVD, and Epitaxy
- Minimum of 3–5 years of experience as a process engineer, or a combination of relevant academic and industry experience
- Experience with DRAM and NAND device integration and technology development preferred
- Experience with advanced packaging integration and process development (wafer-level hybrid bonding, fusion bonding, die-to-wafer, HBM) preferred
- Strong knowledge of semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and ALD deposition equipment
- Demonstrated success in film deposition optimization and process development; experience with ASM ALD, PEALD, PECVD, and Epitaxy tools is a strong plus
- Experience with Design of Experiments (DOE), SPC, and statistical analysis methods
- Proactive in supporting escalations, developing and managing action plans, and facilitating clear communication among customers, service teams, and business units
- Willingness to travel to Business Units for training and to customer sites as required
- Primary location onsite in Boise, Idaho, with domestic and international travel to support escalations, transfers, and HVM sites as needed
- Strong understanding of intellectual property boundaries between ASM and customers, with the ability to maintain IP integrity in all interactions
- Excellent verbal and written communication skills Nice to Have
- Candidates with additional experience may be considered for higher job grades or senior-level roles Compensation & Benefits
- Salary range and benefits not disclosed in the posting