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Senior Engineer - Thermal and Mechanical Design (Next-Gen Liquid Cooling)

Koch IP Holdings, LLC.

About this role

Job title: Senior Engineer - Thermal and Mechanical Design (Next-Gen Liquid Cooling)

About the Role This role supports Koch’s R&D/Product Development Engineering Teams, focusing on developing next-generation liquid cooling solutions for AI servers, data centers, and high-power electronics. The engineer will lead the design and development of advanced cold plate technologies, innovative coolant flow architectures, and emerging joining/welding processes to improve thermal performance, reliability, and manufacturability. The role requires strong expertise in thermal-mechanical design, fluid flow optimization, and advanced manufacturing to drive product innovation from concept to mass production.

What You'll Do

  • Lead the development of next-generation liquid cooling products and thermal management solutions for high-performance computing and AI infrastructure.
  • Define product architecture, design concepts, and technology roadmaps for future liquid cooling platforms.
  • Evaluate emerging cooling technologies and drive innovation to improve thermal performance, reliability, and cost competitiveness.
  • Lead the design and development of advanced cold plates, including high-performance internal structures and thermal enhancement features.
  • Develop innovative cold plate architectures to support increasing heat flux requirements and next-generation processor platforms.
  • Collaborate with thermal engineers to optimize thermal resistance, pressure drop, manufacturability, and system integration.
  • Develop innovative coolant flow path designs and manifold architectures to improve cooling efficiency and flow distribution.
  • Optimize internal channel structures, flow balancing strategies, and pressure drop performance through simulation and experimental validation.
  • Apply CFD analysis and design methodologies to achieve superior thermal-fluid performance.
  • Lead the development and qualification of new cold plate joining technologies, including vacuum brazing, laser welding, friction stir welding, diffusion bonding, and other advanced manufacturing processes.
  • Collaborate with suppliers and manufacturing teams to evaluate process capability, reliability, and scalability.
  • Drive process innovation to improve product performance, yield, and production efficiency.
  • End-to-End Product Development: Lead product development from concept, prototype, design validation, and qualification through mass production.
  • Establish design verification plans, reliability requirements, and manufacturing readiness criteria.
  • Drive DFM, DFA, and cost optimization activities throughout the product lifecycle.

What We're Looking For

  • Bachelor’s or Master’s degree in mechanical engineering, Thermal Engineering, or a related field.
  • 7–10+ years of experience in thermal and mechanical design.
  • Proficiency in CAD software (e.g., NX, Creo, SolidWorks).
  • Familiarity with End-to-End Development (Concept to Production).
  • Experience with manufacturing processes (CNC machining, stamping, plating, injection molding, LSR molding, Rubber Molding Process).
  • Experience with mechanical & thermal design and testing requirements.
  • Excellent problem-solving and analytical skills, able to deeply analyze testing failure modes with a focus on manufacturability and quality control.
  • Demonstrated experience working with cross-functional teams in English.
  • Tolerance stack-up analysis for CAD and product specification definition, review thermal and reliability testing report.

Nice to Have

  • Hands-on experience in advanced cold plate design and liquid cooling product development.
  • Strong knowledge of coolant flow path optimization, manifold architecture design, and CFD analysis.
  • Experience with advanced joining technologies such as vacuum brazing, laser welding, diffusion bonding, friction stir welding, or seal welding.
  • Experience developing liquid cooling solutions for AI servers, data centers, HPC, or telecom infrastructure.
  • Deep understanding of heat transfer, fluid dynamics, thermal interface materials, and cooling system reliability.
  • Proven track record in bringing innovative thermal products from concept to mass production.

Compensation & Benefits At Koch, we are entrepreneurs who challenge the status quo and create value. Any compensation range provided for a role is an estimate determined by available market data and may be higher or lower based on knowledge, skills, abilities, and geographic location. If you have questions, please speak with your recruiter about the flexibility and detail of our compensation philosophy.

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