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Senior Engineer, Process Engineering | Global R&D Process Engineering Program

ASM International N.V.
Leuven, Belgium; Helsinki, Finland (training); permanent role in Greater Tokyo, Japan; Phoenix, AZ, United States; Dongtan Semiconductor Valley, South Korea
On-site

About this role

Job title: Senior Engineer, Process Engineering | Global R&D Process Engineering Program

About the Role Senior Engineer, Process Engineering within ASM’s Global R&D Process Engineering Program will develop next-generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program combining structured learning with hands-on work using ASM’s processing equipment. After the initial period, you will relocate to one of ASM’s R&D centers in Japan, Korea, or the United States (Arizona) for a permanent role to advance new technologies at the core of ASM’s business units.

What You'll Do

  • Work with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
  • Design and conduct experiments, measure and interpret outputs, and apply DOE and RSM to fulfill objectives.
  • Perform process consulting, write technical papers on advanced process applications, and contribute to IP creation.
  • Troubleshoot equipment problems with hands-on problem solving and present findings in technical sessions.
  • Work with customers and central marketing to understand requirements, document demonstrations, and develop methods to integrate metal/oxide films into device technologies; support product transfers with documentation.
  • Travel up to 10% to support demonstrations and customer sites.

What We're Looking For

  • PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
  • 0-7+ years of education, research, and work experience with ALD, CVD, Epitaxy, PECVD or related thin-film deposition; materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
  • Knowledge of electrical characterization techniques for CMOS devices and application of dielectric and/or metal films for logic and memory structures.
  • CFD training (theoretical or practical) is preferred. Knowledge of CMOS devices is preferred.
  • Demonstrated ability to manage complex process development projects; creative problem solving; understanding of hardware design interplay with process outputs; knowledge of integration of metals as work function materials and barrier layers in FEOL/BEOL.
  • Experience with deposition processes using first principles and experimental design techniques (DOE, RSM).
  • Experience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, TEM/HRTEM, FESEM, Auger, Raman, and ellipsometry.

Nice to Have

  • Optional/preferred qualifications (not explicitly specified in the posting).

Compensation & Benefits

  • Not disclosed in the posting. The program includes 18-24 months of structured development training at flagship hubs followed by relocation to a permanent role in ASM’s global R&D centers. Travel to customer sites is up to ~10%.

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