Semiconductor Assembly Mass Production Engineer

Gunma Semiconductor Assembly Mass Production Engineer

Job Description

We are seeking an experienced back-end assembly engineer specializing in FCBGA and WLCSP, including support for the R-CAR series, one of Renesas’ key automotive product lines.

The successful candidate will initially take primary technical responsibility for FCBGA/WLCSP products manufactured at both domestic and overseas internal manufacturing sites and OSATs. In the future, the scope of responsibility is expected to expand to cover a broader range of flip-chip package technologies, including Chiplet packages.

As a significant portion of the products are manufactured by overseas OSATs, we expect the candidate to take a proactive approach to communication and collaboration in both Japanese and English.

As this is a replacement hire following the departure of the previous engineer, we are ideally looking for an experienced professional who can make an immediate contribution. At the same time, strong support will be available from the experienced direct manager, and we welcome someone who is motivated to contribute to the team and continue growing together with us.

Lead Assembly Process Engineer for FCBGA/WLCSP, responsible for assembly engineering from development through mass production.

• Development: Technical verification and review of development results.
• Mass Production: Assembly yield, cost, and quality improvement activities; management of product/process changes; and coordination with relevant functions.
• Issue Resolution: Development and technical review of root cause and corrective actions; coordination with Quality Assurance; and customer support.

The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.

Qualifications

• MUST

• Business-level communication skills in Japanese and conversational skills in English for daily communication (TOEIC score of approximately 600).

• Basic knowledge of semiconductor back-end processes.

• Relevant work experience in the following areas:

• Yield/quality/cost improvement related to Assembly process.

• Troubleshooting and issue resolution related to Assembly process.

• WANT

Hands-on experience in the following areas:

• Yield/quality/cost improvement for FCBGA.

• Yield/quality/cost improvement for WLCSP.

• Yield/quality/cost improvement for Assembly processes.

• Troubleshooting and issue resolution for Assembly processes.

• Coordination with overseas subcontractors/OSATs.

• Additional Information

• Renesas is a global company providing embedded semiconductor solutions under the purpose To Make Our Lives Easier. With engineers and problem solvers in over 30 countries, we work on cutting-edge technologies for automotive, industrial, infrastructure, and IoT to contribute to a safer, healthier, and more environmentally friendly, smarter future.

• Renesas has TAGIE as a core part of its corporate culture: Transparent, Agile, Global, Innovative, Entrepreneurial. These values support our work style, growth, and Purpose.

• We offer competitive compensation and benefits details will be provided during the selection process.

• Join us to create the future together. We look forward to your application.

• Location: Takasaki, Japan

• Requisition ID: 20035056_2026-10-20