R&D Engineer, Passive Optical Interconnect Integration

Job title: R&D Engineer, Passive Optical Interconnect Integration

About the Role Develop integrated structural solutions for high-density passive all-optical connectivity, including glass-based optical interconnects, heterogeneous integration of passive Chiplet optical engines, and multi-passive-device coupling, to enable AI computing scenarios. Collaborate with optical R&D and packaging teams to verify integration solutions and balance density, manufacturing cost, and product stability.

What You'll Do

• Develop integrated structural solutions for high-density passive all-optical connectivity, including design and optimization of glass-based optical interconnects and heterogeneous integration of passive Chiplet optical engines and multi-passive-device coupling.
• Develop high-density-compatible optical interface structures and fiber alignment coupling structures to meet ultra-high bandwidth passive all-optical connectivity requirements for AI computing, addressing size matching and low-loss coupling between passive photonic components and fibers/optical waveguides.
• Collaborate with optical R&D and packaging teams to complete integration solution verification, optimize process compatibility of integrated structures, and balance integration density, manufacturing cost and product stability.
• Responsible for reliability verification of integrated passive optical interconnect structures, track test results to complete structural iteration, and output complete structural design documents and process specifications.
• Track cutting-edge passive optical interconnect technologies, perform technical pre-research and adapt solutions to the company’s product roadmap.

What We're Looking For

• Bachelor’s degree or above in Mechanical Engineering, Electronic Packaging, Optoelectronic Engineering or related fields; 3+ years of R&D experience in semiconductor/optoelectronic integrated passive structure development.
• Proficiency in NX/SolidWorks or other structural design tools, mastery of structural simulation and tolerance analysis, and understanding of basic principles of optical coupling.
• Familiar with structural design requirements for heterogeneous integration and advanced packaging of passive components; understanding structural processing characteristics of glass and silicon substrates.
• Strong technical pre-research ability and troubleshooting capability; able to independently drive integrated structural project delivery and collaborate smoothly across teams.

Nice to Have

• Experience in silicon photonic packaging or passive optical engine packaging is preferred.
• Experience in CPO/silicon photonic passive interconnect integration development is preferred.