About this role
The principal package engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production. Drive optimal silicon packaging solution supporting Azure datacenter product roadmap. Drive package technology for chiplet architecture with advanced 2.5D/3D packaging. Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout Define, design and develop test vehicles to validate Silicon, Package, System performance. Drive supplier assessments and manage suppliers through definition, development, qualification and production. Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options. Define EDA tools requirements for advanced 3DIC packaging designs Design and develop package and assembly drawings to support the manufacturing. Design and develop package and assembly drawings to support the manufacturing. Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR Master's Degree in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 12+ years technical engineering experience OR equivalent experience. 15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D) Foundation in advanced packaging technologies, manufacturing and supplier management Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs. Working knowledge in defining test vehicle strategies that appropriately envelope product design and use conditions, isolate key technical risks, and generate actionable data to support engineering decisions while balancing test coverage, learning objectives, and program timelines. Experience in thermo-mechanical FEA, with the ability to translate simulation results into product design requirements, identify and quantify key failure risks, guide design tradeoffs, and develop risk-mitigation and validation strategies. Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis Experience with OSAT, Supplier & Foundry technologies. Experience in physical failure analysis Experience in subcontract supplier management. Record of success in cross-functional team environment