About this role
About the Role As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intel's leadership in high-performance computing, AI, and chiplet architectures. This role operates at the intersection of pathfinding, technology development, and manufacturing, with responsibility for driving hybrid bonding capability from first-of-a-kind platform development through qualification, ramp, and high-volume manufacturing.
What You'll Do
- Lead the development and delivery of the Die-to-Wafer Hybrid Bonding (HBI) module from FOK through qualification, ramp, and high-volume manufacturing.
- Collaborate with cross-functional teams spanning design, process, and manufacturing to scale next-generation packaging technologies for HPC, AI, and chiplet architectures.
- Define technical roadmaps, requirements, and risk mitigation strategies for the HBI platform.
- Drive early platform development toward scalable, high-volume manufacturing readiness and robust yield.
- Mentor engineers and guide multi-disciplinary teams to solve complex integration challenges.
What We're Looking For
- Principal Engineer with deep experience in advanced packaging, die-to-wafer bonding, and hybrid bonding technologies.
- Track record of taking packaging platforms from concept or FOK through qualification, ramp, and high-volume manufacturing.
- Strong collaboration and communication skills with the ability to influence across design, process, and manufacturing functions.
- Technical leadership in semiconductor manufacturing environments, with a focus on reliability, yield, and process integration.
Nice to Have
- Prior experience specifically with Die-to-Wafer Hybrid Bonding (HBI) or related bonding technologies.
- Familiarity with roadmap development for packaging platforms and cross-functional program management.
Compensation & Benefits
- Not disclosed in the job posting