Principal Advanced Packaging Design Engineer

Job title: Principal Advanced Packaging Design Engineer

About the Role Lead and mentor small project teams to deliver innovative high-quality packaging solutions for HPC/AI and networking applications. Interface with package suppliers to select technologies that meet manufacturability, performance, reliability, and cost requirements.

What You'll Do

• Lead small project teams of design and simulation engineers to deliver packaging solutions.
• Interface with package suppliers to select technologies ensuring manufacturability and compliance with performance, reliability, and cost targets.
• Collaborate with chip design and electrical simulation teams to optimize the design and contribute to tool, process, and flow development.
• Work on advanced 2.5D/3D packaging technologies (CoWoS-S/R/L, EMIB, CPO, CPCF) and multi-chip configurations.
• Apply expertise in signal integrity, power integrity, thermal integrity, and PDN design to ensure manufacturability and reliability.
• Lead programs involving cross-functional teams across multiple time zones.

What We're Looking For

• Extensive experience in substrate and/or board design for advanced package technologies; fundamental understanding of design for manufacturing and reliability, plus electrical performance with trade-off decisions.
• Proven ability to lead complex package architecture development involving internal and external stakeholders.
• Mastery in Cadence 3DIC/ISP/APD/SiP; familiarity with Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks.
• Bachelor’s degree in electrical engineering or related field and 15+ years of experience, or master’s with 12+ years, or PhD with 8+ years.
• Experience with HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIe, Ethernet; strong signal and power integrity understanding at substrate, board, package, and system levels.
• Knowledge of advanced 2.5D/3D packaging tech (CoWoS-S/R/L, EMIB, CPO, CPCF).
• Strong communication, presentation and documentation skills; ability to work with stakeholders across time zones; cross-functional collaboration.
• Ability to manage programs involving cross-functional teams.

Compensation & Benefits

• Base pay range: USD 168,400 – 249,310 per year.
• Employee stock purchase plan with a 2-year look back.
• Family support programs, mental health resources, and recognition/service awards.