Power Integrity Engineer - Advanced Packaging

Job title: Power Integrity Engineer - Advanced Packaging

About the Role Marvell is seeking a High-speed IC package development engineer to join the Central Engineering Packaging organization. You will contribute to the development of advanced microelectronic packages for semiconductors and support data rates up to 448 Gb/s and beyond. The role focuses on power integrity optimization of the PDN, while accounting for manufacturing and assembly tolerances, and you will collaborate with package layout teams, marketers, and IC designers to define feasible package specifications and drive new packaging technology.

What You'll Do

• Own package development, electrical design, modeling, and characterization of advanced packaging PDN with emphasis on power integrity, taking manufacturing and assembly tolerances into account.
• Interface with the package layout design team to ensure manufacturability and compliance with performance, reliability, and cost targets.
• Interface with marketing and IC designers to translate requirements into achievable package specs and contribute to new package technology development.
• Contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
• Document results and collaborate across functions to improve processes and establish robust SI/PI workflows.

What We're Looking For

• Bachelor’s degree in Electrical Engineering with 3–5 years of related professional experience or Master’s/PhD with 1–3 years’ experience.
• Strong fundamentals in electrical circuits, electromagnetics, transmission lines and microwave theory, Signal and Power Integrity.
• Experience with 2-D and 3-D EM simulation tools such as Ansys SIWave, Cadence Clarity/PowerDC/PowerSI/XtractIM, Keysight ADS.
• Frequency-domain and time-domain knowledge of high-speed signaling; channel simulations using MATLAB or ADS.
• Power plane design, modeling, and analysis for Power Integrity.
• Familiarity with IC package or PCB layout tools (Cadence APD, Mentor PADS, Xpedition Package Designer).
• 2.5D/3D package development is desirable.
• Working knowledge of circuit design tools (Spectre, ADS, HSpice, Ansys Electronics Desktop).
• Familiarity with packaging technologies, materials, substrate design rules, and assembly rules.
• Track record of new product introduction from concept through production is a plus.
• Knowledge of thermal and mechanical analysis is a plus.
• Ability to automate SI/PI/Packaging activities using scripting tools like Python or TCL is a plus.
• Strong teamwork, communication, presentation, and documentation skills; good English (verbal and written).

Nice to Have

• 2.5D/3D package development experience is desirable.
• Scripting automation (Python, TCL) is a plus.
• Thermal and mechanical analysis knowledge is a plus.

Compensation & Benefits

• Expected Base Pay Range: 152,700 - 203,600 RON per annum.
• Competitive compensation and great benefits within a collaborative, transparent, and inclusive work environment.