About this role
Job title: Packaging Module Development Engineer
About the Role The Advanced Packaging Technology Manufacturing division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
What You'll Do
- Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnects for Intel's packaging platforms.
- Collaborate with cross-functional teams to translate next-generation packaging concepts into manufacturable solutions.
- Support development and scale-up of packaging processes for high-volume manufacturing.
What We're Looking For
- Not specified in the posted description.