About this role
Job title: Package Integration Engineer
About the Role The Package Integration Engineer will oversee packaging integration and vendor coordination from design to manufacturing within the Celestial AI Systems and Packaging group. They'll define day-to-day priorities, guide build plans, drive yield improvement, and ensure smooth project execution.
What You'll Do
- Work with cross-functional teams to coordinate package integration, design, manufacturing and reliability efforts of test vehicles and product builds
- Work with OSAT (Outsourced Semiconductor Assembly and Test) and other 3rd party vendors to bring product from concept to NPI (New Product Introduction) and HVM (High-Volume Manufacturing)
- Align day-to-day activities of individual contributors and managers and track progress in project and document management software
- Use DOE (Design of Experiment) principles and engineering judgement to propose and manage material build plans to support process development, material selection, bring up, test, and reliability efforts
- Analyze manufacturing data (inline monitors, test, third party updates) to provide source-of-truth reports on yield, failure modes and development progress
- Participate in and support path-finding activities in package assembly and test
What We're Looking For
- MS in physical sciences/engineering and 10+ years of relevant industry experience
- Exposure to full product life cycle (end to end)
- Experience in working with third party foundries and/or OSATs
- Advanced degree in science or engineering fields
- Understanding of cross-functional packaging areas (floor plan, layout and architecture, process, thermal, mechanical, SI/PI, testing, and FA)
- Demonstrated technical judgement in context of assemblies of various form factors, thermo-mechanical, reliability, and cost constraints
- Familiarity with optical packaging
- Familiarity with systems engineering procedures
- Previous experience with Atlassian Jira/Confluence systems
- Previous experience with data analysis in JMP/Py/R
- Excellent problem solving and communication skills
PREFERRED QUALIFICATIONS
- Advanced degree in science or engineering fields
- Understanding of cross-functional packaging areas (floor plan, layout and architecture, process, thermal, mechanical, SI/PI, testing, and FA)
- Demonstrated technical judgement in context of assemblies of various form factors, thermo-mechanical, reliability, and cost constraints
- Familiarity with optical packaging
- Familiarity with systems engineering procedures
- Previous experience with Atlassian Jira/Confluence systems
- Previous experience with data analysis in JMP/Py/R
- Excellent problem solving and communication skills
Compensation & Benefits
- Salary range (USD) 119,620 - 179,200 per year
- Additional Compensation and Benefit Elements: employee stock purchase plan with a 2-year look back, family support programs, robust mental health resources, and recognition and service awards to celebrate contributions and milestones.