About this role
Job title: Package Failure Analysis Engineer
About the Role Intel is seeking a Package Failure Analysis Engineer to support root cause determination of assembled package yield loss and in-line failures. The role involves working on a back-end week compressed shift, performing design, test, checkout, modifications, and characterization of assembly technologies to improve yield and reliability.
What You'll Do
- Investigate root cause of yield loss in assembled packages and in-line failures.
- Perform design, test, checkout, modifications, and characterization of assembly technologies.
- Work on a compressed shift schedule (back-end of week) on-site.
What We're Looking For
- Experience with root cause analysis and failure analysis in semiconductor packaging.
- Knowledge of assembly technologies and related design, test, checkout, and characterization.
- Ability to work on shift and collaborate with cross-functional teams.