Package Development, Signal Integrity and Power Integrity Engineer, Staff

Job title: Package Development, Signal Integrity and Power Integrity Engineer, Staff

About the Role Marvell’s Central Engineering team seeks a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will handle package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while accounting for manufacturing and assembly tolerances. The role involves interfacing with package suppliers to select technology, drive layout, ensure manufacturability, and ensure performance, reliability, and cost targets; as well as collaborating with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What You'll Do

• Develop and model high-speed IC packages, ensuring signal and power integrity while considering manufacturing tolerances.
• Interface with package suppliers to select package technology, drive layout, ensure manufacturability, and guarantee performance, reliability, and cost requirements.
• Collaborate with marketing and IC designers to translate requirements into achievable package specs and contribute to new package technology development.

What We're Looking For

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields with 5 - 8 years of experience or Master’s/PhD with 1-3 years of experience.
• Strong fundamentals in EM, transmission lines and microwave theory.
• Experience with 2-D and 3-D EM simulation tools (Ansys HFSS, SI-Wave, Cadence Clarity).
• Ability to manage package development involving cross-functional teams (assembly development, IC layout teams, analog and digital designers, marketing).
• Familiarity with IC package layout tools like APD or PADS.
• Experience with 2.5D/3D package development is highly desired.
• Ability to automate SI, PI and packaging activities using scripting tools like Python.
• Working knowledge of circuit design tools (Spectre, ADS, HSpice).
• Experience with VNA and TDR measurements for package and PCB characterization.
• Frequency-domain and time-domain knowledge of high-speed signaling.
• Experience with high-speed electronic packaging for digital and analog ICs.
• Power plane design, modeling and analysis using tools like PowerSI, SIwave.
• Familiarity with packaging technologies, materials, substrate design rules and assembly rules.
• Understanding, debugging and simulations of EMI/EMC problems.
• Track record of new product introduction from concept through development and production is a plus.
• Knowledge of thermal and mechanical analysis of IC package development is a plus.
• Experience with channel simulations using MATLAB or ADS or other tools is a plus.
• Team player with strong communication, presentation, and documentation skills.

Nice to Have

• 2.5D/3D package development experience.
• Additional experience with cross-functional collaboration in a fast-paced environment.
• Experience with EMI/EMC mitigation strategies and thermal-mechanical integration in packages.

Compensation & Benefits

• Salary range: USD 121,000 – 179,040 per year.
• Benefits and programs include an employee stock purchase plan with a 2-year look back, family support programs, robust mental health resources, and recognition/service awards to celebrate contributions and milestones.
• All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.