Lead Hardware Engineer - Onsite

Job title: Lead Hardware Engineer - Onsite

About the Role Lead hardware engineer within Curtiss-Wright's Defense Solutions Group, focusing on leading the design and development of complex electrical boards, SBCs, FPGA, switches and I/O cards in 3U and 6U VPX form factors, plus custom form-factor systems with software/firmware/hardware security.

What You'll Do

• Lead the design and development of 3U and 6U VPX SBC, FPGA, switch, and I/O cards for high-speed data processing applications.
• Lead the design and development of custom form-factor systems including SBC, FPGA, switch, I/O cards, power supplies, and thermal management elements, including Liquid-Flow-Through methods.
• Provide technical leadership in translating customer requirements into system architectures, functional designs, and hardware solutions.
• Evaluate technical feasibility and recommend design approaches balancing performance, cost, reliability, and manufacturability.
• Act as a technical lead for hardware development activities, supporting project execution, design reviews, and technical decision-making.
• Lead hardware testing, qualification, and troubleshooting activities to ensure compliance with requirements and customer expectations.
• Establish and promote engineering best practices to improve product performance, reliability, and time-to-market.
• Develop, review, and maintain technical procedures, design documentation, and engineering manuals.
• Mentor engineers and provide technical direction to support team development and successful project execution.

What We're Looking For

• Bachelor’s degree in Electrical Engineering required; Master’s degree preferred.
• Minimum 8 years of experience in DoD embedded systems and hardware design, including SBC, FPGA, switch, and I/O card development.
• Extensive experience designing mixed-signal, high-speed digital, analog, and low-power, high-current circuits in high-reliability environments.
• Strong experience designing high-density interconnect PCBs, including complex multi-layer designs, multi-lamination processes, blind/buried vias, and uVia structures.
• Hands-on experience with Siemens Expedition DX Designer and Siemens Expedition PCB tools.
• Ability to lead technical efforts, prioritize competing tasks, drive execution, and deliver results in high-pressure, schedule-driven environments.
• Demonstrated experience providing technical leadership, mentoring engineers, and guiding complex hardware designs from concept through production.
• Strong understanding of hardware architecture, design trade-offs, verification, qualification, and production support.
• Excellent communication skills with the ability to collaborate effectively with engineering teams, customers, and cross-functional stakeholders.
• Proficient in Microsoft Office applications.

Nice to Have

• Experience with Liquid-Flow-Through cooling is a plus.
• Familiarity with MOSA concepts or modular open systems approaches is a plus.

Compensation & Benefits

• Salary Range: $108,900 - $150,000 per year plus bonus.
• Paid Time Off; 401K with Employer Match and Profit Sharing; Health and Wellness Benefits; Learning and Development Opportunities; Referral Program; Competitive Pay; Recognition; Employee Stock Purchase Plan; Inclusive & Supportive Culture.