About this role
Engineer I -Process (Ball Attach)
Job Description:
- Lead and support start-up of Ball attach line and new products
- Establish initial process conditions and validate readiness for mass production
- Monitor early production performance and stabilize process during ramp-up phase
- Identify and mitigate start-up risks affecting yield, quality, and throughput
- Monitor and maintain ball attach process parameters to ensure stability and consistency
- Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles)
- Perform DOE (Design of Experiments) to determine optimal process windows
- Continuously optimize recipes to improve yield, efficiency, and reliability
- Standardize and release qualified recipes for production use
- Ensure compliance with established process control plans and specifications
- Perform regular process audits and line checks
- Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation)
- Identify root causes and implement corrective and preventive actions
- Respond to production issues and equipment-related abnormalities
- Conduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D)
- Coordinate with Equipment, Quality, and Production teams for resolution
- Participate in process improvement projects and cost reduction activities
- Recommend and implement best practices for improved efficiency
- Maintain and update process documentation including work instructions and SOPs
- Ensure compliance with internal quality standards and audit requirements
- Support internal and external Customer audits
Requirements/Qualifications:
- Bachelor’s Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent)
- Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process
- Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process
- Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
- Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
- Good communication skills and ability to work in a team-oriented environment.
- Knowledge of safety protocols and cleanroom practices.
- Strong experience with WLCSP or advanced packaging tools is highly preferred
- Proficiency in MS Office and maintenance management systems.
- Strong analytical and problem-solving skills
- Leadership and mentoring capability
- Good communication and teamwork skills
- High attention to detail and sense of accountability
Travel Time:
- 0% - 25%