Electro-optical Signal Integrity, Principal Engineer

Job title: Electro-optical Signal Integrity, Principal Engineer

About the Role Define, simulate, and drive the architecture of high-frequency electrical interfaces for next-generation silicon photonics-based optical engines (400G/lane CPO and beyond). Lead signal integrity strategy across electrical and electro-optical interfaces, influencing architecture, packaging, and system definition. Drive co-design across photonics, analog/ASIC design, and packaging teams to optimize performance, power efficiency, and signal integrity.

What You'll Do

• Define, simulate, and drive the architecture of high-frequency interfaces for optical engines (400G/lane CPO and beyond).
• Lead signal integrity strategy across electrical and electro-optical interfaces; influence architecture, packaging, and system definition.
• Drive co-design across photonics, analog/ASIC design, and packaging teams to optimize performance, power efficiency, and signal integrity.
• Lead testing, characterization, and qualification of components and integrated systems.
• Develop and validate end-to-end link budgets, correlating simulation and measurement across electrical and optical domains.
• Analyze and interpret measurement data to identify performance limitations and drive design improvements.
• Lead root cause analysis of complex signal integrity issues across electrical and optical domains.

What We're Looking For

• Master’s degree or PhD in Electrical Engineering, Photonics, or a related field.
• 5+ years of industry experience in a high-tech engineering environment.
• Strong understanding of RF/microwave engineering, signal integrity, high-frequency circuit theory, interconnects, silicon photonics, and semiconductor packaging.
• Strong background in optical communications (coherent and/or IM/DD) or high-frequency electrical/electro-optical characterization (>110 GHz).
• Hands-on experience in electro-optical device testing (e.g., modulators, photodetectors, lasers); high-speed testing preferred.
• In-depth experience in two or more of the following: 3D EM modeling and simulation (HFSS preferred), high-frequency circuit simulation (ADS preferred), and/or RF PCB design.
• High-frequency characterization and data modulation (VNA, AWG, PPG, oscilloscope, DCA, BERT).
• Python or MATLAB for lab automation, data analysis, or system simulation.
• High-speed link modeling, channel budgets, and equalization techniques (FFE, DFE, CTLE), including metrics such as BER, SNR, OMA, TDECQ, and eye diagrams.
• Interfacing with high-speed SerDes (≥200G PAM4, ideally 400G PAM4) and familiarity with industry standards (IEEE 802.3, OIF CEI).
• Advanced packaging and/or 2.5D/3D integration in optical platforms.
• Personal qualities: Strong ownership mindset with the ability to operate autonomously in a fast-paced environment; Collaborative approach; Excellent communication skills.

Nice to Have

• Experience with advanced packaging or 2.5D/3D integration in optical platforms (as an optional/preferred qualification).

Compensation & Benefits

• Competitive compensation and great benefits, with an environment of shared collaboration, transparency, and inclusivity. We provide tools and resources to grow and develop with us.