Director of Technical Leader for Advanced PBCA and System Integration-Vietnam

Responsibilities

• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
• Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
• technology, component packaging and / or process material. Fostering strong and collaborative
• relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
• and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
• Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
• professionals.

Requirements

• 1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
• 2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
• PCBA and SI and minimum 5 years in management position.
• 3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
• environment with a proven record.
• 4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
• Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
• preferable,
• 5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
• interpersonal skill
• 6. Ability to lead projects from beginning to end and drive initiatives with a global team.
• 7. Ability to work under pressure.
• 8. Work location is in Vietnam