Director, New Product Development

Job title: Director, New Product Development

About the Role The Director, New Product Development will be responsible for evaluating the Datacenter/AI rack market and customers, recognizing trends, and planning to penetrate opportunities that deploy a liquid cooled interconnect solution for switch and compute applications. This role defines the customer engagement strategy for the Thermal engineering teams and collaborates with the organization to drive revenue and profit growth through customer design wins. It also includes coordinating product support functions (application engineering, qualification testing, etc.) and leading business planning and execution of the product development roadmap and operational readiness (supply planning, production capacity, supplier selection, and related activities).

What You'll Do

• Engage customer engineering teams to lead the technical specification development for the liquid cooled cage product including total power, temperature rise, liquid flow rates, mechanical geometry specific to front panel chassis requirements supporting both networking and compute hardware specific to host (switch) to module (NIC card) cabling applications.
• Identify product and application trends/opportunities to drive next-gen product roadmaps aligning with Switch and GPU silicon suppliers in addition to the enterprise networking chassis suppliers.
• Support application engineering during system bring up/debug (Thermal qualification).
• On site test set up, troubleshooting and design engineering feedback to address application specific changes.
• Establish partnerships with the liquid cooling eco system (Cold plate, QD) suppliers.
• Acting as a technical lead to establish acceptable performance criteria, tolerance ranges, long term reliability and durability as well as developing an advanced development roadmap to address potential future needs of next generation systems.
• Set direction to ensure operational readiness to support customer qualification and production timing requirements.

What We're Looking For

• Bachelor degree in Engineering or related technical discipline (Optics, Electrical and or mechanical engineering)
• At least 7 years of thermal component development (High speed communication systems) and program/project management
• Experience in cold plate implementations at the Chassis and Rack level for Design and test
• Experience developing customer relationships at the leadership level
• Experience communicating across all levels of business and executive leadership presence
• Business acumen to deliver high level communication in the specified field

Compensation & Benefits

• Salary range: USD 200,000 - 250,000 per year
• Benefits include medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance.