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Development Engineer (回流焊工艺开发)
Danfoss
onsite
Nanjing, CN
About this role
Job Title: Development Engineer (回流焊工艺开发)
The Impact You'll Make
作为一名开发工程师，你将主要负责半导体功率模块的工艺开发与材料验证，尤其是回流焊接工艺的开发和应用。
What You’ll Be Doing
- 主导完成半导体功率模块工艺开发，如：贴片，焊接，引线键合, pin针和功率端子超声焊；
- 设计工装夹具完成相应的工艺和材料验证；
- 通过实验设计识别最优工艺参数；
- 通过材料分析识别工艺缺陷，并提出优化方案；
- 根据工艺要求制定设备技术规范；
What We're Looking For
- 本科及以上学历，电力电子、机械工程、材料科学或相关专业；
- 5年以上功率半导体从业经验，至少3年功率模块工艺开发经验，有项目管理经验优先；
- 熟练掌握和使用至少一种机械制图软件，如：NX，Solidworks等，了解ISO-GPS标准，能够按要求输出工程图纸；
- 具有功率模块生产工艺实际操作经验（印刷，贴片，真空焊接，铝线绑定，pin针焊接等）；
- 具有团队合作意识，以及良好的沟通能力。
What You'll Get from Us
- We promote from within and support your learning with mentoring, training, and access to global opportunities.
- You’ll have flexibility, autonomy, and support to do your best work while maintaining a healthy work-life balance. Your well-being matters to us.
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