CPU Core Physical Design Thermal Modeling Lead

CPU Core Physical Design Thermal Modeling Lead

The role: We are seeking a lead Physical Design Engineer to ensure that CPU Cores and SOC meet Thermal requirements and Silicon Performance. This is a technical role focusing on Physical design methodology requirements for power and thermals across IPs.

The person: You will be a proven technical leader with the ability to drive cross-functional alignment and execution across architecture, physical design implementation, package modeling teams, ensuring timely closure and multi-dimensional alignment of power, thermal management and performance constraints. You will also be highly organized and execution-driven, with demonstrated success owning end-to-end technical workstreams and driving closure of open issues, risks, and dependencies across program milestones.

Key responsibilities

• Drive development and alignment of thermal modeling methodology, collaborating with Package modeling teams across AMD products.
• Drive new design and analysis methodologies to improve product thermal profile.
• Translate product usage model, workload, and package requirements into IP performance, power, and thermal constraints and align with product performance-power models.
• Drive thermal product requirements cross-function, managing critical deliverables at key project milestones.

Preferred experience:

• Strong Physical Design background with extensive EDA tool experience.
• Excellent knowledge of physical design power and performance metrics, and experience in high-performance SoC/IP design.
• Familiarity with package models and advance packaging designs.
• Familiarity collaborating with pre-silicon design and package modeling teams and aligning architecture assumptions/targets with projections.
• Expertise in scripting and flow automation.

Academic credentials:

• Bachelors or Masters degree in computer engineering/Electrical Engineering

Location

Santa Clara, CA, or other AMD offices (Austin, Fort Collins, Boxborough)