Packaging Engineer
About this role
Packaging Engineer
THE ROLE: Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.
THE PERSON: The successful candidates must have strong commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, analytics & trouble shooting skill with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.
KEY RESPONSIBILITIES
- Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
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