Packaging Engineer
About this role
THE ROLE
Lead technology development and supply chain bring up of advanced substrate technologies to support AMD product roadmap
THE PERSON
The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate. He/she should have a hands-on approach to new process development with a deep knowledge of packaging and board design rules, process flows and materials. They should have excellent oral and written communication skills to communicate ideas and technology target requirements with suppliers, internal partners, product architects and AMD management.
KEY RESPONSIBILITIES
- Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
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